Substitute Materials for Complete Elimination of （替代材料的完全消除）.pdf

Substitute Materials for Complete Elimination of Hazardous Substances - Study of Whisker Growth on Lead-Free Plating - V Seiki Sakuyama V Michinori Kutami (Manuscript received January 20, 2005) To elucidate the mechanism of tin (Sn) whisker growth on lead (Pb)-free plated electrodes, we studied their growth behavior. Concerning the structure in which Sn whiskers originate, we determined that the whiskers are created by the recrystalliza- tion of Sn when the Sn grain size of whisker sources is coarser than that of the surrounding grains. We also found that there is a more than 700-hour period of laten- cy before the whiskers appear in Sn plating, which correlates with the incubation period of Sn recrystallization. The longer the latency period of the plating, the greater the danger of needle-like whiskers growing. We also observed that needle-like whis- kers grow most easily under the conditions of 25°C plus the application of external stress. We therefore chose those conditions for a probability test of Sn whisker growth. 1. Introduction ment of substitute parts and materials and the In the midst of increasing awareness of maintenance of part and material reliability is also environmental problems around the world, many important. A point that particularly requires regulations concerning hazardous materials are attention is identifying which problems will arise being established, for example, the waste electri- concerning de