Surface finish test method project proposal （表面光洁度测试方法项目建议书）.pdfVIP

Copper Wire Bonding Draft Proposal iNEMI November 2009 Background • Using gold wire as the electrical interconnection between the integrated circuit and the corresponding PWB substrate is the most common and well understood material; however the use of Cu wire is increasing • Studies indicate that copper wire can achieve greater mechanical stability than gold wire • Standard bond strength tests such as the wire pull test and the ball shear test have demonstrated that copper ball bonds exhibit 25%-30% higher readings than comparable gold ball bonds 2 Background (con’t.) • Copper wire bonds can be so strong that the wire itself does not break during wire pull testing, resulting instead in bond pad metal lifting. • Using Cu wire has some distinct advantages as well as disadvantages (see next slide) • Cu wire bonding has been explored at the IC interface and the substrate interface using “standard” PWB materials • New PWB materials are being introduced at an increasing rate and little information is known about the impact of Cu wire bonding on the reliability of these new material systems 3 Background (Copper Wire Bonding) Advantages Disadvantages • Lower cost • Tends to undergo oxidation at • High thermal conductivity relatively lower temperatures • Low electrical resistance • Hardness requires bonding parameter (bond force and • Higher breaking load (smaller ultrasonic energy in particular) wir