The effect of Germanium additions on SN100C （SN100C锗的影响增加）.pdf

The effect of Germanium additions on SN100C Nihon Superior Co., Ltd. What is SN100C? SN100C is a lead-free solder that is based on the Tin-Copper Eutectic: Sn-0.7Cu with a trace addition of Ni at a very specific level and Germanium (Ge). The effect of Germanium additions Ⅰ- The effect of bridge elimination The effect of bridge elimination on SN100C SN100C makes bridge-free soldering possible even with 100pin 0.5mm pitch QFP. 100pin 0.5mm pitch QFP Wave soldering With SN100C The mechanism of bridging Whether or not bridging occurs depends on what happens as the joint exits the wave (the “peel back” area) The mechanism of bridging Whether or not bridging occurs depends on what happens as the joint exits the wave (the “peel back” area) If drainage is good there is no excess solder left on the joints So there is no solder to form a bridge The Peel-Back Solder is draining off Area the joint area back into the solder bath The mechanism of bridging Whether or not bridging occurs depends on what happens as the joint exits the wave (the “peel back” area) If drainage is not good there is excess solder left on the joints This excess solder forms a bridge The mechanism of bridging Whether or not bridging occurs depends on what happens as the joint exits the wave (the “peel back” area) To study the effect of bridge elimination, the icicle test was carried out and the drainage characteristic of solder wave were confirmed. The mechanism o