Tutorial for Assignment #3 Heat Transfer （教程转让# 3传热）.pdfVIP

University of Victoria MECH420 – Finite Element Methods Summer 2012 Tutorial for Assignment #3 Heat Transfer Analysis By ANSYS (Mechanical APDL) V.13.0 1 Problem Description This exercise consists of an analysis of an electronics component cooling design using fins: All electronic components generate heat during the course of their operation. To ensure optimal working of the component, the generated heat needs to be removed. This is done by attaching fins to the device which aid in rapid heat removal to the surroundings. For the sake of simplicity, we’ll assume that the electronic circuit is made of copper with thermal conductivity of 386 W/mºK and that it generates heat at the rate of 1 W. The enclosing container is made of a steel with thermal conductivity of 17 W/mºK. The fins are made of aluminum with thermal conductivity of 180 W/mºK. There is convection along all the boundaries except the bottom, which is insulated. The film (convection) coefficient is h=50 W/m2ºK and the ambient temperature is 20ºC. Figure 1: Problem geometry 1.1 OBJECTIVE: Determine an optimal number of fins to use on the component. Cases considered should all use an odd number of fins (3, 5, 7, …). By: Majid Soleimaninia Page 1 University of Victoria MECH420 – Finite Element Methods Summer 2012 1.2 Deliverables: A hardcopy submission that includes: 1. A plot of the temperature distribution in the component for the baseline case of 3 cooling fins and for your recommended number of fins. 2. A plot generated using Matlab that shows the reduction of the maximum temperature in the component as a function of the number of fins. Students are encouraged to collaborate with each other by distributing the tasks of modeling the specific cases (each case differing in