bga点胶问题（BGA dispensing problems）.doc

bga点胶问题（BGA dispensing problems） The products produced by our company will cause the PCB pad to fall off and BGA scrapped when the BGA is repaired after dispensing We use the method of maintenance? The glue is epoxy resin AB glue, is the manufacturers recommended repair mode 1. use the hot air gun to blow the glue first (about 300 degrees temperature; time / 2~~3 minutes), then remove the glue slowly with tweezers; 2., then heat the components with a hot-air gun and remove it; 3. use ethylene glycol to remove PAD How to solder and remove BGA packaged IC 2009-09-08, 11:48 to join, share, forward, share Renren, Kaixin, Sina, micro-blog, Sohu blog, Baidu collection, Google collection, QQ bookmarks, watercress, Facebook, Twitter, Yahoo, Digg, Bookmarks, BGA, IC If the direct welding repair with a hot-air gun case, BGA IC is likely to be damaged or broken or bottom pin solder and lead oxide, so we must take BGA IC off replacement or repair plant tin. Non adhesive BGA welding BGA must pay attention to inject enough flux at the bottom of the IC, so you can make the solder balls are uniformly distributed in the bottom of IC pin, easy reloading, using vacuum suction pen or tweezers, with a hot-air gun plus BGA IC welding procedure, loose after carefully removed, remove the IC, even if the ball, with iron drag ball is connected to the ball all suck. Note chrome tip, try not to touch the motherboard, so as not to scrape off the pin or damage green insulation. Welding of sealing adhesive BGA Some of the BGAIC in mobile phones are packaged with chemicals to fix the BGAIC and reduce the failure rate, but if problems occur, its a big hassle for maintenance. At present, there have been some dissolved drugs on the market. They only have good effect on the BGA sealing of the Samsung series and the Motorola mobile phones, and some of them still have nothing to do with sealing glue. Some potions are poisonous and are often harmful to the body. The circuit board also has a certain corro