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smt生产工艺流程(SMT process flow)
smt生产工艺流程(SMT process flow)
The basic elements of SMT Technology
SMT basic elements include: screen printing process (or dispensing), mount (curing), reflow soldering, cleaning, inspection, repair
1, printing: its role is to pad solder paste or glue stencil to patch PCB, preparing for welding components. The equipment used for screen printing (screen printing), is in the front of SMT production line.
2, it is the glue dispensing: drop to the fixed position of PCB, its main role is to be fixed to the components on the PCB board. The equipment used for dispensing machine, SMT production line is located behind the front or test equipment.
3, Mount: its role is to accurate surface mount component mounted to the fixed position on PCB. The equipment used for the machine, behind the screen SMT production line machine.
4, curing: its function is to melt adhesive, so that the surface mount component and PCB board firmly bonded together. The equipment used for curing furnace, located behind the patch SMT production line machine.
5, reflow soldering: its role is to make the solder melting, surface mount component and PCB board firmly bonded together. The equipment used for the reflow oven, located behind the patch SMT production line machine.
6, cleaning: the role of the PCB board assembled the harmful residues such as welding flux removal etc.. The equipment used for cleaning machine, location is not fixed, can be online or not online.
7, detection: its function is to detect the quality of welding and assembly quality of PCB plate assembly. The equipment used a magnifying glass, microscope, online tester (ICT), flying probe tester, automatic optical inspection (AOI), X-RAY detection system, function testing instrument etc.. According to the position detection, can be configured in the production line of the right place.
8, repair: the role of PCB in fault detection for rework. The tool for iron, rework stations etc.. Any location in the production line.
A single assembly:
Inc
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