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pcb检验规范1(PCB inspection specification 1)
pcb检验规范1(PCB inspection specification 1)
Inspection methods and criteria
8.1 packing inspection
8.1.1 look at the packaging, sealing, moisture-proof packaging requirements, otherwise a serious defect.
8.1.2 look at the package label and contents and be deemed to be seriously defective if the specifications and specifications are not met.
8.2 appearance inspection
8.2.1 view circuit board (PCB) model, version number, if not conform to specifications or incoming material requirements, as a serious defect.
8.2.2 view pads or gold fingers, requiring smooth, smooth, well coat or tin, such as the size of the pad is less than the required 2/3 or pad
Incomplete, convicted of serious defects such as coating on the tin layer; or oxidation, pollution or obvious adverse effects on the appearance, and the tin or conduction device,
It is deemed to be a serious defect.
8.2.3 contrast film or engineering drawings, to see whether the surface of the screen is clear (identifiable), correct, whether the screen printing shift, such as silk
The printing can not be recognized or incorrectly judged to be a serious defect, such as a screen printing shift caused by misreading or the upper pad and the impact on the tin, as a serious defect,
Otherwise, depending on the situation, acceptance / light deficiency is identified. Contrast the sample board to see whether the layout of the screen is correct and correct.
8.2.4 back light plate bottom, look in front of each hole, check the situation such as blocking effect of Tongse, plug-in or location, found
Heavy defects (the number of defects per plate), otherwise judged to be acceptable.
8.2.5 use the microscope / magnifier to observe the wiring of the circuit board, such as short circuit, fracture or concave convex, beyond the width of the circuit
1/3 is a serious defect.
8.2.6 check the flatness of the board, such as the bending or bending of the board, if necessary, use the platform and caliper to detect bending, such as bending or warping
The m
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