multi-scale analysis of mems sensors subject to drop impacts多尺度分析mems传感器下降的影响.pdfVIP

Sensors 2007, 7, 1817-1833 sensors ISSN 1424-8220 c 2007 by MDPI /sensors Full Paper Multi-scale Analysis of MEMS Sensors Subject to Drop Impacts Stefano Mariani 1,⋆, Aldo Ghisi 1, Alberto Corigliano 1 and Sarah Zerbini 2 1 Dipartimento di Ingegneria Strutturale, Politecnico di Milano Piazza L. da Vinci 32, 20133 Milano (Italy). E-mails: stefano.mariani@polimi.it, aldo.ghisi@polimi.it, alberto.corigliano@polimi.it 2 MEMS Product Division, STMicroelectronics Via Tolomeo 1, 20010 Cornaredo (Italy). E-mail: sarah.zerbini@ ⋆ Author to whom correspondence should be addressed. E-mail: stefano.mariani@polimi.it Received: 30 August 2007 / Accepted: 6 September 2007 / Published: 7 September 2007 Abstract: The effect of accidental drops on MEMS sensors are examined within the frame- work of a multi-scale finite element approach. With specific reference to a polysilicon MEMS accelerometer supported by a naked die, the analysis is decoupled into macro-scale (at die length-scale) and meso-scale (at MEMS length-scale) simulations, accounting for the very small inertial contribution of the sensor to the overall dynamics of the device. Macro-scale analyses are adopted to get insights into the link between shock waves caused by the impact against a target surface and propagating inside the die, and the displacement/acceleration his- tories at the MEMS anchor points. Meso-scale analyses are adopted to detect the most stressed details of the sensor and to assess