real-time fault classification for plasma processes为等离子体过程实时故障分类.pdfVIP

Sensors 2011, 11, 7037-7054; doi:10.3390/s110707037 OPEN ACCESS sensors ISSN 1424-8220 /journal/sensors Article Real-Time Fault Classification for Plasma Processes Ryan Yang and Rongshun Chen * Department of Power Mechanical Engineering, National Tsing Hua University, Hsinchu 30013, Taiwan; E-Mail: ryyanga@ * Author to whom correspondence should be addressed; E-Mail: rchen@.tw; Tel.: +886-3-574-2596; Fax: +886-3-572-2840. Received: 19 May 2011; in revised form: 28 June 2011 / Accepted: 30 June 2011 / Published: 6 July 2011 Abstract: Plasma process tools, which usually cost several millions of US dollars, are often used in the semiconductor fabrication etching process. If the plasma process is halted due to some process fault, the productivity will be reduced and the cost will increase. In order to maximize the product/wafer yield and tool productivity, a timely and effective fault process detection is required in a plasma reactor. The classification of fault events can help the users to quickly identify fault processes, and thus can save downtime of the plasma tool. In this work, optical emission spectroscopy (OES) is employed as the metrology sensor for in-situ process monitoring. Splitting into twelve different match rates by spectrum bands, the matching rate indicator in our previous work (Yang, R.; Chen, R.S. Sensors 2010, 10, 5703-5723) is used to detect the fault process. Based on the match data,