锡合金、钎料合金制造工艺配方专业资料（Tin alloy, solder alloy, manufacturing process, formulation, professional data）.docVIP

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锡合金、钎料合金制造工艺配方专业资料（Tin alloy, solder alloy, manufacturing process, formulation, professional data）.doc

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锡合金、钎料合金制造工艺配方专业资料（Tin alloy, solder alloy, manufacturing process, formulation, professional data）

锡合金、钎料合金制造工艺配方专业资料（Tin alloy, solder alloy, manufacturing process, formulation, professional data） Tin alloy, solder alloy, manufacturing process, formulation, professional data A colored alloy consisting of other alloy elements based on tin. The main alloying elements are lead, antimony, copper and so on. Tin alloy of low melting point, strength and hardness are low, it has high thermal conductivity and low thermal expansion coefficient, corrosion resistance, has excellent antifriction capability, and easy to steel, copper, aluminum and its alloy materials such as welding, solder is good. Tin solder. Tin lead alloy, the melting point of about 183 DEG C, used for welding components of the electrical instrumentation, commonly used solder material with a tin lead alloy solder, solder, solder and cadmium, antimony, copper and silver solder and solder, suitable for manual welding, wave soldering, reflow soldering process. In order that the enterprise can produce high performance tin alloy welding materials, improve product quality, production safety and environmental protection products, Beijing Heng Chi technology development company jointly compiled by the relevant units, new technology at home and abroad the latest development of polymerization of polyvinyl chloride. The data include well-known companies at home and abroad, research institutions and well-known enterprises of the latest patented technology full text data, including the manufacture of raw materials, formula, production process, product performance testing and standards, to solve specific problems and so on, is the enterprise to improve the product quality and new product development important and practical value, and rare technical data. International new technology information network Beijing Heng Xin letter Technology Development Co., Ltd. Address: Beijing City Public Security University in South China fiscal office block B 415 (100038) Contact person: Miss Zhang, Mr. Xu, QQ:2214458379 [item number]