导电胶的应用和研究（Application and research of conductive adhesive）.docVIP

导电胶的应用和研究（Application and research of conductive adhesive） Application and research of conductive adhesive.Txt Application and research of conductive adhesive 1. overview of conductive adhesive The conductive adhesive is a kind of curing or drying has certain conductive adhesive, it is usually the matrix resin and conductive filler of conductive particles is the main component of the bonding resin matrix of the conductive particles together to form a conductive path, the conductive connection is sticky material. The matrix resin conductive adhesive is an adhesive, you can choose the appropriate curing temperature of the adhesive, such as epoxy resin adhesive can be cured at room temperature to 150 DEG C, far lower than the temperature above the welding tin lead welding of 200 DEG C, which avoids the formation of material welding high temperature may lead to deformation of electronic device, thermal damage and the internal stress. At the same time, due to the rapid development of miniaturization, miniaturization of electronic components and printed circuit board with high density and high integration, the minimum distance of 0.65mm tin welding far can not meet the actual demand of the electrical connection, and the conductive adhesive can be made into slurry, achieved very high resolution line. Moreover, the conductive adhesive has simple process, easy operation, improved production efficiency, and avoids environmental pollution caused by heavy metal lead in tin lead solder. So the conductive adhesive is to replace tin welding, to achieve the ideal choice for electrical connection. The conductive adhesive has been widely used in liquid crystal display (LCD), light emitting diode (LED), integrated circuit (IC) chip, printed circuit board assembly (PCBA), packaging and clay lattice block, ceramic capacitor, thin film switch, smart card, RFID and other electronic components and assemblies, replace conventional soldering gradually the trend of welding. Classification and