2015年半导体制造研究综述.pdf

北京佐思信息咨询有限责任公司 Room 502, Unit 3, Tower C, Changyuan Tiandi Bldg, No.18, Suzhou Street, Haidian District, Beijing, 100080 Tel: 400-009-0050 2015 年半导体制造研究综述 2015 Semiconductor Manufacturing Research Review Report Description REPORT HIGHLIGHTS The global market for thermal interface materials will grow from $763.7 million in 2015 to nearly $1.1 billion by 2020 with a compound annual growth rate (CAGR) of 7.4% for the period of 2015-2020. The global market for organic light emitting diodes (OLED) was $2.1 billion and $2.5 billion in 2013 and 2014, respectively. The market is expected to reach nearly $3.1 billion in 2015 and $9.6 billion in 2020, registering a compound annual growth rate (CAGR) of 25.7% for the period 2015-2020. The global wafer-level packaging (WLP) market was valued at $1.3 billion in 2013. This market is expected to grow from $1.6 billion in 2014 to $4.9 billion by 2019, with a compound annual grow th rate (CAGR) of 24.5% from 2014 to 2019. REPORT SCOPE Research Reviews from BCC Research provide market professionals with concise market coverage within a specific research category. These Research Reviews include portions of several market research reports that were published in 2015, and are an efficient way for market professionals to keep up with the general market developments of 2015. Please note that page references in the text are to pages in the original, complete report, and do not reflect the actual page numbers in this Research Review. This 2015 Semiconductors Research Review includes excerpts from the follow