课件-介观材料力学-2013.pptVIP

西安交通大学博士论文答辩 Titanic 号钢板（左图）和近代船用钢板（右图）的冲击试验结果 Polymer substrate (Stretchable) Tension-tension fatigue (Microforce tester) Key point: Subtracting or avoiding the influence of deformed substrate 3 % elastic deformation P = 250 N + 1 mN polyimide 4. 金属薄膜的疲劳性能——柔性基板 Previous methods on fatigue lifetime (Nf) measurement Shortcomings: complicated and structurally instable at definition point Strain range change (Kraft et al. 2001) Extrusion density counting (Volkert et al. 2008) Nf Load-controlled Saturated Ex-situ measurement 4. 金属薄膜的疲劳性能——柔性基板 Suggestion of a much more simple method Fatigue lifetime for microcrack nucleation (Verified by SEM) Relative change in ER Cu In-situ measurement 4. 金属薄膜的疲劳性能——柔性基板 Thin Cu and Al films: △ε– Nf Curves Following the well-known Coffin-Manson relationship Al films (80nm-800nm) Cu films (100nm-3.75 μm) 4. 金属薄膜的疲劳性能——柔性基板 Thin Cu films: thickness dependent Nf The thinner is the film, the longer is the Nf Fatigue lifetime Yield strength ductility 4. 金属薄膜的疲劳性能——柔性基板 Comparing with others’ results Shorter than others’ experimental results Nano-thick Cu film Micro-thick Cu films 4. 金属薄膜的疲劳性能——柔性基板 In-situ testing in a SEM chamber Thermal fatigue Time variant resistance and T Based on the resistance-temperature relationship, ?T (?ε) can be determined Monig, et al., Rev. Sci. Ins. 75 (2004) 4997 Electrical open: Nf ?ε = ?α x ?T Mismatch in TEC 4. 金属薄膜的疲劳性能——刚性基板 3. 金属导线的力学性能评价——试样制备 1）光刻 2）显影 3）溅射 掩膜 基体 光刻胶 Cu膜 4）二次显影 微米级线宽 “工”字型试样 3. 金属导线的力学性能评价——试样形貌 10mm 10mm 100um 1mm 5mm 3mm Previous work on the Thermal fatigue of Cu thin films Nf vs ?T and ?ε Damage morphology Park et al., Thin Solid Films 504 (2006) 321 Volkert et al., Thin Solid Films 515 (2007) 3253 300 nm-thick Cu 1.5 μm GS 200 nm-thick Cu 0.5 μm GS In all the previous reports, the Cu films have a thickness 200 nm and an average grain size 500 nm, within this region dislocation is operative So, how about the thermal fatigue of more thinner and more finer Cu