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- 约2.54万字
- 约 8页
- 2017-11-04 发布于天津
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29 10 Vol.29 No.10
2017 10 Journal of Computer-Aided Design Computer Graphics Oct. 2017
基于色彩特征与邻域信息的焊点定位方法
1,3) 1,3)* 1) 1,3) 2)
吴 茜 , 谢 非 , 彭 晨 , 杨建飞 , 徐宝国
1) (南京师范大学电气与自动化工程学院 南京 210042)
2) (东南大学仪器科学与工程学院 南京 210096)
3) (江苏省三维打印装备与制造重点实验室 南京 210042)
(xiefei@njnu.edu.cn)
: 为防止集成电路由于元件相互影响及受到外部干扰而无法正常工作, 对高集成度电路板进行绝缘封装必不可
少. 针对印刷电路板(printed circuit board, PCB)上焊点区域小、数量多、位置密集、形态多样等问题, 提出基于色彩特
征与邻域信息的多形态焊点定位方法. 首先通过建立色彩特征模型, 提取 PCB 的单色色度区间特征与多色色差特征;
然后提出了基于色彩特征的多形态焊点定位方法, 在完成焊点初定位的基础上, 采用窗口扫描法提取像素点的邻域信
息, 进一步提出基于邻域信息的焊点精确定位优化方法, 能够有效地提高PCB 焊点区域的定位精度. 实验结果表明, 该
方法能大幅提高焊点区域的填充率及滤除误判像素点, 满足对PCB 上多形态焊点区域的精确定位需求.
:焊点定位; 色彩特征; 邻域信息; 视觉测量
:TP391.41
Solder Joint Location Method Based on Color Feature and Neighborhood Information
Wu Qian1,3), Xie Fei1,3)*, Peng Chen1), Yang Jianfei1,3), and Xu Baoguo2)
1) (School of Electrical Automation Engineering, Nanjing Normal University, Nanjing 210042)
2) (School of Instrument Science and Engineering, Southeast University, Nanjing 210096)
3) (Jiangsu Key Laboratory of 3D Printing Equipment and Manufacturing, Nanjing 210042)
Abstract: In order to prevent the integrated circuit from inter-inference or external interference of the compo-
nents, it is necessary to keep the high integration circuit board in the insulated encapsulation. Considering the
current Printed Circuit Board (PCB) requires small welding, large quantity, intensive distribution, varied shapes, a
color feature and neighborhood information based method is proposed in this paper. A color feature model is first
established to extract th
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