无铅微焊点热疲劳特性分析及优化.pdfVIP

摘 要 近年来，人们越来越重视环境污染问题，还有在科技飞速发展的推动下，电子元件 的封装采用了无铅焊料进 焊接，而且随着微电子产品向微型化、高性能方向发展，用 于连接芯片与基板的微焊点尺寸也缩小到几十微米甚至几微米，目前最小的焊点已经达 到十几微米。然而微焊点所承载的力学、电学和热力学负荷却是越来越重,所以对微焊 点的可靠性要求日益提高，但是就现在研究状况来看，人们对无铅微焊点抵抗破坏的能 力以及热疲劳特性分析还不是很成熟，而且焊点的无铅化和微型化将是现在以及未来的 重点研究方向，所以对无铅微焊点的研究具有重大意义。 本文主要对无铅微焊点的热疲劳特性进行分析研究，选用BGA的球栅阵列是焊点件 进行了三维有限元数值模 分析，选择焊点半径50- 100微米之间，以Anand统一粘塑性本构方程描述无铅微焊点的粘塑性 为。首先，研究 微焊点在变化温度循环载荷下微焊点的等效应力和塑性应变的分布规律, 找出实体模型中最大应力和应变的微焊点位置。其次，分析出最大应力焊点的等效应力 周期性变化和应力应变滞后曲线。最后，选取焊点直径、焊点高度、芯片厚度、PCB厚度 四个对无铅微焊点热疲劳特性影响显著的因素进行四因素三水平的正交试验，并进行不 同因素、不同数值下的最大应力分析，找出各因素对微焊点应力的影响趋势，找出其影 响微焊点应力的主要因素，并对各因素影响大小进行排序，找出应力最小的微焊点尺寸 ，实现微焊点在结构上的优化。为人们对电子元件的无铅微焊接封装方法和焊点尺寸的 选择提供一些理论参考依据。 关键词：无铅微焊点、热疲劳特性、等效应力、塑性应变、正交试验 Analysis and optimization of thermal fatigue properties for the lead free solder joints Student：LI Guo-man Teacher: DAI Xuan-jun Abstract: In recent years, there is growing emphasis on environmental problems, as well as in promoting the rapid development of technology, electronic packaging using lead-free solder for welding, and with the miniaturization of microelectronics, high-performance direction, with micro size solder connecting the chip and the substrate is also reduced to tens of microns or even a few microns, the smallest solder has reached more than ten microns. However, the mechanical micro bumps carried, electrical and thermal load is getting heavier and heavier, so the reliability of solder joints slightly increasing, but for now study situation, people are lead-free solder resist micro damage capacity and thermal fatigue resistance analysis is not very mature, and lead-free solder and miniaturization will be the focus of current and future research directions, and therefore have great significance for the study of lead-free micro bumps. This paper focuses on the thermal fatigue properties of lead-free solder joints micro analysis and