电子显微分析（章晓中）教学课件chapter16.pdfVIP

Chapter 6 Scanning Electron Microscopy (SEM) Signal used in Electron Microscopy 6.1 Inelastic Scattering (非弹性散射) • Electron diffraction and TEM imaging mainly use elastic scattering electrons • SEM imaging mainly use inelastic scattering electrons • EDS (in TEM and SEM) and EELS (in TEM) also use inelastic scattering electrons Inelastic scattering • Characteristic X-ray (特征X射线) – used for EDS in TEM and SEM • Secondary electron (二次电子) – Slow secondary electron (二次电子) • used for SEM imaging (morphology) – Auger Electron (俄歇电子) • used for surface analysis • Others – Energy-loss transmitted electron (能量损失透射电子) • used for EELS in TEM – Backscattered electron (背散射电子) • used for SEM imaging (composition) Characteristic X-ray (特征X射线) If more than a critical amount of energy is transferred to an inner shell electron, that electron is ejected. e.g. an K shell electron is ejected from the atom by a high-energy electron, leaving a hole in the K shell. When the hole in the K shell is filled by an electron from L shell, characteristic Ka X-ray emission occurs. • The energy of the characteristic X-ray is characteristic of the difference in energy of the two electron shells involved. • If we fill a K-shell hole from the L shell we get a Ka X-ray. If we fill a K-shell hole from the M shell we get a Kb X-ray. In microanalysis we only use the most intense lines, usually the Ka X-ray. Incident electron beam •The characteristic X-ray with a Auger electron specific energy can be used as an SE unambiguous （确定的）sign of the BSE presence of an