译文：Plasma Processes for Printed Circuit Board Manufacturing---等离子在线路板制造行业的应用.docVIP

Plasma Processes for Printed Circuit Board Manufacturing 等离子在线路板制造行业的应用 By Lou Fierro and James D. Getty Accelerating performance requirementsare driving the demand for highspeed, multilayer PCBs. Traditional manufacturingmethods for laminating these layered boards and removing residue from the via sare no longer effective. The use of radio frequency driven, low-pressure plasma provides efficient, cost-effective and environmentally friendly method for surface treatmentand cleaning of the boards. Specific applications of plasma technology to PCB manufacturing, critical parameters, and process examples will be discussed. 加速增长的需求推动技术的高速发展，对于多层板来说，传统的多层板层压和via孔除胶工艺不再有效。伴随着无线电信号频率的提升，等离子技术开始使用，对于线路板表面清洁工艺来说，它是一个低成本和环境友好的方案。本文中将讨论等离子工艺在PCB制造业的细节应用、临界参数和加工案例。 Innovations in PCB material technology and the use of smaller geometries have led to an increased requirement for plasma processing at multiple steps in the manufacturing cycle. Multilayer PCBs with high-density interconnects require designs with finer pitch, smaller vias, and the use of new material technologies with high glass transition temperatures and low loss factors. While these materials solve coefficient of thermal expansion (CTE) and speed issues, difficulties arise during board manufacturing where the use of traditional processes is limited. 随着PCB材料工艺的改革和外形的精细化，使得等离子处理工艺在制程中得到了大量的应用。HDI多层板设计要求小间距、小via孔以及使用高TG低信号损耗的新材料。这些材料解决了热膨胀系数问题并得到大量应用，在这个时候传统的加工工艺出现了问题 Chemical processing with permanganate chemistry is limited due to the inability of the fluid to penetrate the small vias found in multilayer PCBs. In addition, permanganate does not effectively clean the very small via holes that are usually located at the inner layer level of laser-drilled via holes. Other wet chemistries, such as acid etch, have difficulties etching polyimide dielectric materials. Plasma processing overcomes these limitations due to the inherent penetrating nature of plasma and the ability to precisely control the process. Plasma can