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单位换算plating thickness charts
USEFUL DATA CONVERSION
IMPERIAL MEASURMENTS
THOU also known as MIL = 1 Thousand / Inch = 25.4 Microns
MICRO INCH = 1 Million / Inch = 0.0254 Microns
SQ INCH = 645.16 SQ MM
SQ FT = 92903 SQ MM
METRIC MEASURMENTS
MICRO METER also known as MICRON = 1 Million / Meter
1 CM = 10000 Microns
1mm = 1000 Microns
1 Thou = 25.4 Microns
1 Micron = 39.37 Micro inches.
MILLIMICRON also known as NANOMETER = 1 Thousand / Micron
1 Micron = 1000 Millimicrons
SQ DCM = 100 SQ CMs = 15.50 square inches
COPPER WEIGHTS
1oz 305 Grams copper / SQ Meter = 35 micron thickness
2oz 610 Grams copper / SQ Meter = 70 microns
3oz 915 Grams copper / SQ Meter = 105 microns
4oz 1220 Grams copper / SQ Meter = 140 microns
6oz 1830 Grams copper / SQ Meter = 210 microns
8oz 2440 Grams copper / SQ Meter = 280 microns
10oz 3050 Grams copper / SQ Meter = 350 microns
12oz 3660 Grams copper / SQ Meter = 420 microns
GOLD PLATING TECHNOLOGIES AND OTHER SURFACE FINISH UNDERSTANDING
Terminology
Auto catalytic is also known as Electroless and is a chemically activated plating solution
Electroplating is also known as Electrolytic and requires the use of anode / cathode and electrical charge to build up the metal deposits.
ENIG Electroless Nickel Immersion Gold
Chemical Process that deposits 5 – 7 microns electroless nickel that is then immersion gold plated with 0.05 – 0.10 microns pure gold.
This is a self limiting gold process; the thickness is consistent and wont deposit above 0.10.
Used as a finish for surface mount soldering with solder paste and reflow technology.
The gold is used to protect the quality of the nickel plate and prevent oxidisation.
There are two versions of ENIG this is only to be considered when wire bonding is required the standard fi
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