BS EN 60749-20-2009 半导体器件.机械和气候试验方法.塑料包封的SMDs的抗湿及钎焊热度综合影响.pdf

BS EN 60749-20:2009 Semiconductor devices — Mechanical and climatic test methods — Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat BS EN 60749-20:2009 BRITISH STANDARD National foreword This British Standard is the UK implementation of EN 60749-20:2009. It is identical to IEC 60749-20:2008. It supersedes BS EN 60749-20:2003 which is withdrawn. The UK participation in its preparation was entrusted to Technical Committee EPL/47, Semiconductors. A list of organizations represented on this committee can be obtained on request to its secretary. This publication does not purport to include all the necessary provisions of a contract. Users are responsible for its correct application. © BSI 2010 ISBN 978 0 580 59478 6 ICS 31.080.01 Compliance with a British Standard cannot confer immunity from legal obligations. Amendments issued since publication Amd. No. Date Text affected