半导体工艺与设备.doc

ICP电感耦合等离子体inductively coupled。ECR电子回旋共振electron cyclotron resonance。APCVD常压cvd，atmospheric。Cmos互补金属氧化半导体complementary metal-oxide-semiconductor。SMT,manufacturing。LED,emission diode。PSG磷硅玻璃phosphorus。RF射频radio frequency why silicon?abundant cheap,silicon dioxide dielectric grow thermal,band gap,operation range. Sand to wafer quartz,sand,react,purify vaporization condensation,react,melt,cut,saw,edge,laser 单晶硅锭后处理，1.shaping operation,2.sawing,3.lapping and edge rounding,4.etching,5,polishing,6,cleaning,detectioning and packaging Comparison CZ和FZ。Popular cheaper，size,reusable materials.floating zone,pure silicon crystal,expensive size,mainly for power devices Crystal structures,amorphous,polycrystal,single crystal 氧化应用diffusion,surface,isolation,gate 氧化前清洗particulates,organic residues,inorganic,netive oxide layer 氧化速度，temperature;chemistry,wet or etch;thickness;pressure;orientation,silicon HPO,growth,reduce,strength 氧化设备vertical and horizoutal furnance，smaller footprint，better contamination control，better wafer handling，lower maintenance cost and higher uptime 介质薄膜应用interconnection，SOG,STI,LDD,PD,ARC,ILD,PMD,IMD CVD,1,mass(reactants)2,film(dissociation)3,diffusion(film),4,adsorption,5precursor,6,surface,7,desorption,8,by-product Water vapor source,boiler,bubbler,flush,pyrogenic 注入好处1.duce. 5.low.6.ability.7.solid,8 lateral.缺点1.plexity RTA,annealing out pace diffusion,RTP,post-implantation annealing,RTA,fast,uniformity,budget,minimized Process,issues,wafer,charging,particle,contamination,elemental,process evaluation,方法probe,wave,measurement 注入机设备gas cabin,ion source,electrical system,vacuum pump,analyzer magnet,beamline,plasma floating system,wafer,end analyzer PR composition,polymer,solvents,sensitizers,additives PR requirement,resolution,resistance,adhesion,latitude PR performance factor,resolution,adhesion,source,latitude,pinhole,levels,step,flow 对准和曝光工具，contact，proximity,projection,stepper Standing wave effect,interference,periodically,resolution Hard,bake,evaporati