化学微蚀刻法和微细电镀法制备微流控芯片金属模具工艺对比研究.pdfVIP

第27 卷 第3 期 腐蚀科学与防护技术腐蚀科学与防护技术 Vol.27 No.3 2015 年5 月 CORROSION SCIENCE AND PROTECTION TECHNOLOGY May 2015 化学微蚀刻法和微细电镀法制备微流控芯片金 属模具工艺对比研究 郑文书 郭钟宁 罗红平 江树镇 莫远东 广东工业大学机电工程学院 广州 510006 摘要：针对化学微蚀刻法和微细电镀法制备微流控芯片金属模具进行了工艺对比研究。采用激光共聚焦显 微镜分别检测表征由这两种加工工艺制备所得的模具微结构特征，对其侧壁陡度、尺寸均匀性、粗糙度进行 对比分析。结果表明，化学微蚀刻法制备的模具微结构的侧壁呈不规则弧形、尺寸均匀性差，表面粗糙度较 大(R =3.58 μm) 。而微细电镀法制备的模具微结构的侧壁则呈规则的梯形、尺寸均匀性好，表面粗糙度较小 a (R =0.65 μm) 。微细电镀法制备的微流控芯片金属模具综合效果比化学微蚀刻好。 a 关键词：化学微蚀刻 微细电镀 侧壁陡度 微流控芯片模具 中图分类号：TG 174 文献标识码：A 文章编号：1002-6495(2015)03-0264-05 Comparison Between Micro-chemical Etching and Micro- electroplating Processes for Preparing Metal Mold of Microfluidic Chip ZHENG Wenshu, GUO Zhongning, LUO Hongping, JIANG Shuzhen, MO Yuandong School of Electromechanical Engineering, Guangdong University of Technology, Guangzhou 510006, China Abstract: The features of micro-chemical etching and micro-electroplating processes for preparing metal mold of microfluidic chips have been comparatively studied. The micromorphology of the fabricated molds was characterized in terms of sidewall steepness, dimensional uniformity and sur- face roughness by means of laser scanning confocal microscopy. The results show that, for the mold fabricated by micro-chemical etching, there exist irregular curved sidewall and worse dimen- sional uniformity and its surface roughness Ra is up to 3.58 μm ；by contrast, for the mold prepared by micro-electroplating there exist regular trapezoidal sidewall and better dimensional uniformity and