脉冲电流快速烧结纳米铜焊膏连接铜镍基板研究.PDFVIP

53 4 Vol.53 No. 4 2017 2 JOURNAL OF MECHANICAL ENGINEERING Feb. 2017 DOI 10.3901/JME.2017.04.034 * ( 150001) 57.5 nm (Scanning electron microscope, SEM)(Transmission electron microscope, TEM)X (X-ray diffraction, XRD) (Thermal gravity analysis, TGA)(Differential thermal analysis, DTA) // 0.8 kA 46.3 MPa(200 ms) TG156 Rapidly Sintering of Nano Copper Paste and Interconnection of Copper and Nickel Substrate by Pulse Current HUANG Yuan TIAN Yanhong JIANG Zhi WANG Chenxi (State Key Laboratory of Advanced Welding and Joining, Harbin Institute of Technology, Harbin 150001) Abstract A simple solution method to synthesize Cu nanoparticles with the mean diameter of 57.5 nm is developed, and as-synthesized Cu nanoparticles are characterized systematically, including scanning electron microscope(SEM), transmission electron microscope(TEM), X-ray diffraction(XRD), thermal gravity analysis(TGA) and differential thermal analysis(DTA). The nano copper paste is prepared by dispensing as-prepared Cu nanoparticles into deionized water with the assistance of ultrasonic. The sandwich structure of nickel/nano copper paste/copper is fabricated using a simple screen-printing method and the shear strength of the sandwich structure, the cross-sectional microstructure and fracture micro-structural features under the different pulsed current sintering processes is studied. Experimental results show that the shear strength of the sandwich structur