TO封装半导体激光器结构设计.pdfVIP

TO封装半导体激光器结构设计 摘要 TO封装技术其实就是指, TransistorOutline 或者Through-hole封装技术, 也就是全封闭式封装技术。是现在在应用中上比较常用的微电子器件的封装 方式。TO封装的相对于其他的封装技术,他的长处在于在于寄生参数比较小, 而且成本很低工艺也相对来说简单使用起来更加的灵活方便所以这种封装, , , 器经常用于低频率以下LD,还有LED 以及光接收器件和组件的封装。而且其 内部容量很小,只有四根引线,是不能安装半导体致冷器的。这些年来,随着激光 器阈值的降低对于许多的类似迎用例如短距离通信以及背板之间的连接 以, , , 致冷TO封装激光器获得了及其全面的应用。在封装成本上拥有着极大优势的 由于TO封装,以及人们对封装技术的大量研究,TO封装激光器的速率已经高 10Gb/s, TO 达 近年来高速 形式封装激光器越来越受到人们的青睐。 TO 在 封装半导体激光器中，采用高热导率过渡热沉与热沉组合的结构， 可有效增强TO封装半导体激光器的散热特性，尤其是采用双 热沉结构，更可 将激光器芯片工作产生的热量通过N边和P边同时导向基座，进而更为有效 地 增强 TO 封装的半导体激光器的散热能力，大幅度地去降低激光器有源区的 节温，尽量减小激光器的热阻，从而延长半导体激光器的使用寿命。 关键词：TO封装 ，半导体激光器 ，光电子器件 TheStructureDesignofTOPackagingthe SemiconductorLaser ABSTRACT TO packaging technology, is refers TO the Transistor Outline or Through - hole encapsulation technology, which is fully enclosed packaging technology. Is no in the application of microelectronic devices that are widely used in the packaging. TO encapsulate the relative TO other packaging technology, his 天津理工大学2015届本科毕业设计说明书 strength is that lies in the parasitic parameters are small, and the cost is low, technologyisrelatively simple,userisemore convenient, sothiswrapper isoften used forlo frequencyunderthe LD, andledsandthe lightreceiving deviceand component encapsulation.And its internal capacity is very small, only four lead, cantbe installedsemiconductorrefrigerator. Overtheyears,withthereduction of laser threshold for many similar applications, such as the short distance communication and the connection between the back, with out cooling TO encapsulate laser and its comprehensive application. Has a great advantage in packagingcostsdueTOpackaging,aswellasanumberofstudiesofencapsulation technologypeople,TOencapsulat