第七章 传热学沸腾对流换热9精选.pptVIP

Nine Chapter Boiling And Condensation * Boiling process Condensation process Solid-liquid interface Change in phase of a liquid Condensation Boiling Convection heat transfer Without influencing fluid temperature Phase change Latent heat Surface tension Density difference Three parameters 9.1 Dimensionless Parameters in Boiling and Condensation (1) (2) (3) (1) Jakob number is ratio of the sensible energy to the latent energy. (2) Bond number is the ratio of the gravitational body force to the surface tension force. (3) Unnamed parameter represents the buoyancy-induced fluid motion on heat transfer. 9.2 Boiling Modes When evaporation occurs at a solid-liquid interface, it termed boiling. The process occurs when the temperature of the surface Ts exceeds the saturation temperature corresponding to the liquid pressure Tsat. Boing may occur under various conditions. (1) Pool boiling (by free convection). (2) Forced-convection boiling ( by external means,and free convection. Boiling may also be classified according to subcooled or saturated. (1) Subcooled boiling (TlTsat). (2) Saturated Boiling (TlTsat). (1) Pool Boiling C P D B A Free convection Nucleate Boiling regimes transition Film 5 30 120 10 1000 Critical heat flux Leidenfrost point, Free convection boiling Insufficient vapor in contact with the liquid phase. Free convection fluid motion. Nucleate boiling A-B: Isolated bubbles form at nucleation sites and separate from the surface. Most of the heat exchange is through direct transfer from surface to liquid in motion at the surface. B-C: the vapor escapes as jets or columns. Transition boiling Bubble formation is so rapid that a vapor film or blanket begins to form on the surface. Conditions may oscillate between film and nucleate boiling. Film Boiling The surface is completely covered by a vapor blanket. Heat transfer from the durface to liquid occurs by conduction through the vapor. Radiation through vapor film become significant. 9.3 Pool Boiling Cor