Reliability Testing of Monolithic CIGSS in a GlassGlass英文资料.pdfVIP

Reliability Testing of Monolithic CIGSS in a Glass-Glass Package Richard Wickham – Director of Quality Reliability Outline  Monolithic Cell Structure  Cell Interconnection using MOCVD  Stion Process Overview  Package Design advantages and challenges  Glass-Glass Package Assembly  Managing Mechanical Stress Testing Testing Procedures Frequency  PID Test results  Results of Short Long term Accelerated Aging ALT Stresses Damp Heat Thermo-mechanical Stion Corporation © Copyright 2010 2 Finished Monolithic Circuit Structure Key Elements of the Monolithic Structure Additive film process with laser scribed P1 mechanically scribed P2 / P3 Stion Corporation © Copyright 2010 3 Monolithic CIGSS Manufacturing Process Glass Wash Module Lamination SN Assembly Back Lead Attach J-box Electrode Frame Circuit LP1 Bypass Isolation for frameless Conditioning Precursor P 3 PVD Electrical Test Thermal TCO Label Processing CBD P 2 Clean Package