[信息与通信]Lesson 21 Wafers电子技术专业英语教程.pptVIP

《电子技术专业英语教程》 《电子技术专业英语教程》 Unit 8 Integrated Circuits Lesson 21 Wafers 《电子技术专业英语教程》冯新宇 主编 电子工业出版社 Lesson 21 Wafers Terminology diamond cubic structure 金刚石立方结构 crystal orientation 晶向 Miller index 密勒指数 Terminology silicon wafer 硅晶圆 Ion implantation 离子注入 wafer Fabrication 晶圆制造 radio frequency amplifiers 音频放大器 mechanical strength 机械强度 What is the wafer？ The processes of wafer Fabrication … The procedure of wafer Fabrication … The silicon wafer shaping involves … About crystal orientation … 1 inch. 2 inch (50.8 mm). Thickness 275 μm. 3 inch (76.2 mm). Thickness 375 μm. 4 inch (100 mm). Thickness 525 μm. 5 inch (127 mm) or 125 mm (4.9 inch). Thickness 625 μm. 5.9 inch (150 mm, usually referred to as 6 inch). Thickness 675 μm. 7.9 inch (200 mm, usually referred to as 8 inch). Thickness 725 μm. 11.8 inch (300 mm, usually referred to as 12 inch or Pizza size wafer). Thickness 775 μm. 18 inch (450 mm ). Thickness 925 μm (expected). Vocabulary substrate ,undergo , etch , procedure , optical , cleavage , prototype Structure Reading/writing techniques (=substratum)底层,下层,[地]底土层,基础,本源,[生]培养基,[生化]酶作用物,[摄](胶片)感光底层 The material or substance on which an enzyme acts. 被酶作用：酶在其上进行作用的物质 Biology A surface on which an organism grows or is attached. 【生物学】 基层：动植物生长或附着的表面 An underlying layer; a substratum. 底层，下层土 The wafer serves as the substrate for microelectronic devices built in and over the wafer and undergoes many micro fabrication process steps such as doping or ion implantation, etching, deposition of various materials, and photolithographic patterning. 晶片可以作为基片，经过很多种微加工工艺步骤来完成各种微电子器件的制造。这些工艺步骤包括掺杂、离子注入、刻蚀、各种材料的淀积以及光刻。 chemically polished substrate 化学抛光衬底 circuit substrate 电路衬底, 电路基片 common substrate 共衬底 complementary substrate 互补衬底 conducting substrate 导电衬底 To pass through; experience: 经过；经历 To endure; suffer: 忍受；遭受： The wafer serves as the substrate for microelectronic devices built in and over the wafe