SiC芯片器件研发及产业化建设项目-扬杰科技.PDF

SiC芯片、器件研发及产业化建设项目 环境影响报告书 (公示版) 扬州扬杰电子科技股份有限公司 二○一五年十月 SiC芯片、器件研发及产业化建设项目环境影响报告书 一、 建设单位情况 建设单位：扬州扬杰电子科技股份有限公司 项目名称：节能型功率器件芯片建设项目 项目投资：39773万元 建设地点：扬州市维扬经济开发区荷叶西路 6号扬州扬杰电子科技股份有限公司 厂区内 联系人：韩工 电话：0514 传真：0514 电子邮箱：hanya@21 二、 环评单位情况 评价单位：扬州美境环保科技有限责任公司 单位所在地：扬州市扬子江北路 413号 （中集 ·格兰云天大酒店对面） 联系人：赵工 联系电话：05148011 传真：0514 E-mail：yzhks115@163.com SiC芯片、器件研发及产业化建设项目环境影响报告书 目 录 1 前 ··························································································································7 1.1 项目由来·············································································································7 1.2 项目特点·············································································································7 1.3 环境影响评价工作程序···························································································8 1.4 本项目主要环境问题······························································································8 1.5 环境影响评价主要结论···························································································9 2 总则·························································································································10 2.1 编制依据············································································································10 2.1.1 环境保护法律、法规及规范性文件······················································································10 2.1.2 相关技术文件及参考文献······································································································14 2.1.3 项目有关文件及资料···················································································