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SMT制程原理简介
SMT 製程原理簡介 SMT PROCESS INTRODUCE S.M.T. ?Surface Mount Technology 定義:是指在恰當材質的表面上焊牢為數較多的表面粘裝電子零件(SMDs)的裝配技術. DEFINITION: A technology for mounting electronic components (=SMDs) on the surface of suitable substrate. S.M.D.? Surface Mount Device SMD定義: 亦稱為SMC,是指能夠藉由表面粘著技術焊接在印刷電路板上之有腳或無腳電子零件. DEFINITION:( or surface mount component,SMC), It is a lead or leadless electronic component that is capable of being attached to a printed board by surface mounting. SMT FLOW SMT EQUIPMENT-I MPM Ultra Flex 3000 -Stencil Printer-印刷机 FUJI CP6/CP643/CP742E/CP742ME -High-Speed Mounter-高速置件機 Universal GSM2 /FUJI QP242-Multi-Fun Mounter-泛用置件機 FURUKAWA/HELLER/SMT Reflow-迴焊爐 TRI 518F - ICT Test -ICT測試機 SMT EQUIPMENT-II HOT PLAE - Solder Ball Test -錫球試驗儀 MALCM VISCOMETER PCU-2 -Viscosity Test-粘度測試儀 HIROX - 3D Microscope -3D顯微鏡 Z-CHECK- Solder Paste Thickness Measurement -錫膏厚度量測儀 SMT EQUIPMENT-III DATAPAQ REFLOW TRACKER- Reflow Temperature Curve Record-回焊爐溫度曲線記錄器 FUJI DT III- 2D Measurement Feeder Calibration-座標机 EMC 301A- Stencil Cleaner-鋼板清洗机 超音波清洗機 領料(GETTING THE MATERIALS) 1.工程目的(ENG. PURPOSE): 領取生產用料 Prepare the production materials. 2.作業重點(OPERATION IMPORTANTS): 2.1實物與領料單規格相符 The material’s specification must be the same as your BOM. 2.2數量正確 Quantity must be correct. 錫膏印刷-I(PRINTING SOLDER PASTE) 1.工程目的(ENG. PURPOSE): 均勻的印刷錫膏 Uniform depositing solder paste . 2.作業重點(OPERATION IMPORTANTS): 2.1 確認程式名稱 Confirm the correct program. 2.2 確認鋼板名稱與作業標準書相符 Confirm the stencil name by the SOP 2.3 錫膏印刷品質 The printed quality. 錫膏印刷-II(PRINTING SOLDER PASTE) MPM Ultra Flex3000 STENCIL THICKNESS=0.15 mm -鋼板厚度=0.15mm ~Laser cut -
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