硅片表面兆声清洗的研究-电子信息与电子工程学院毕业设计说明书文献.docVIP

xxxxx INSTITUTE OF TECHNOLOGY 毕 业 论 文 题目： 硅片表面兆声清洗的研究 二级学院： xxx学院 专 业：电子科学与技术 班级： 10电子Y1 学生姓名： xxx 学号： 指导教师： xxx 职称： 研究员高工 评阅教师： 职称： 2014年 6 月 摘 要 在现代这个信息化的时代中，由于集成度的增强、工艺技术的增强以及数模系统的推广，进而造成了集成电路不断发展。并且业界也对集成电路提出了很高的技术要求，即高集成度、高性能和低功耗。而硅片是集成电路中最重要的组成模块之一，它性能的好坏直接影响着整个系统。所以提高硅片性能就显的至关重要。众所周知，提高硅片洁净度就能提高硅片性能，但为了保证集成度和器件的性能,需去除的颗粒尺寸也越来越小,且硅片表面颗粒的粘附强度会随着粒径的减小成数量级地增大,去除起来将更加困难。所以硅片清洗技术已成为现在研究的焦点。 本文介绍了硅片表面兆声清洗技术的原理，然后研究了硅片湿法清洗的原理，接着分析了硅片兆声清洗的方法及流程图，比较了这些方法各自的特性，这是进行设计的技术基础。然后根据课题要求，基于兆声清洗的工艺流程，优化出适合于IC硅片的湿法清洗技术。 关键词：集成电路；IC硅片；湿法；兆声清洗；优化  Abstract In the modern information age, as a result of the integration, enhanced technology and the expansion of analog system, causing the continuous development of integrated circuits. And the industry is also put forward the high technical requirements for integrated circuits, namely, high integration, high performance and low power consumption. And silicon is one of the most important modules of integrated circuit, it is good or bad a direct impact on the performance of the whole system. Therefore, it is very important to improve the performance of silicon wafer is the significant. As is known to all, improve can improve the performance of silicon wafer cleanliness, but in order to ensure that the integration and the performance of the device, the need to remove the particle size is becoming more and more small, and the particles of silicon wafer surface adhesion strength will increase with the decrease of the grain size in order of magnitude, will be harder to remove. So now the wafer cleaning technology has become a research focus. This paper introduces the principle of sound signs in the silicon wafer surface cleaning technology, and then the principle of silicon wet cleaning is studied, and then analyzes the wafers mega sound cleaning method and flow chart, compared the characteristics of the me