微电子制造工艺流程.pptVIP

Pattern Photoresist for Metal1 Interconnects: Silicon Substrate P+ Silicon Epi Layer P- P- Well N- Well N+ Source N+ Drain P+ Source P+ Drain BPSG W Contact Plug Metal1 Photoresist Etch Metal1: An RIE etch utilizing chlorine chemistry. Multiple etch steps are required due to the multiple different metal layers. Silicon Substrate P+ Silicon Epi Layer P- P- Well N- Well N+ Source N+ Drain P+ Source P+ Drain BPSG W Contact Plug Metal1 Photoresist Chlorine = 氯 Strip Photoresist: First interconnect layer is completed. Silicon Substrate P+ Silicon Epi Layer P- P- Well N- Well N+ Source N+ D