IDC设计分析.pdf

IDC Design factor analysis Wire insertion analysis Wire insertion analysis cover Contact arrangement 1 .8 m m Press Assembly method. Fixed the cover, press the connector. cover wire Press force wire has inward tendency in the insertion process,but as the gap is small,wire will not move upward(like stamping) gap As the gap is small,wire will not move upward,insulation is displaced. Main influence factor in the insertion process. a.insulation material/thickness hardness + coefficient of friction + bonding+thickness b.conductor cross section the size and stability of conductor cross section . c.terminal ramp angle,surface finish,roughness of the beam surface, terminal gap, d.insertion tooling maintaining the stability of conductor bundle during insertion. final position of terminal in slot,tooling design to grip the insulation circumferentially and at more than one point can reduce the tendency toward relative motion. Final position Final position 1.Once contact area is established,its integrity is maintained by the residual normal force resulting from the deflection of the IDC beam . 2.Control of wire deformation is arguably of more concern than establishing sufficient force in IDC connection 3.Tighter lay improves dimensional rigidity 4.Surface finish,in particular the conductor finishes, can improve the IDC connection repeatability and performance. Another IDC connection No twist Conductor retention is provided by 1.insulation 2.co