如何使用焊膏涂敷模板.doc

Component Stenciling Template Custom Design Information Background As technology moves forward, the density of adjacent components and solder ball counts has become more complex. In addition, the size and pin count has also become very densely packed. The Component Stenciling Templates, from Metcal, print the solder paste directly on to the component. The templates have simplified the printing process and increased the printing speed during the rework. A component can be printed in less than 30 seconds, compared to up to 20 minutes using previous methods. Two Component Stenciling Template designs have been developed: Printing on balled devices such as BGA, CBGA, CSP, or MICRO BGA, Printing on components that have flat pads, in place of solder balls, such as LLP, LGA. MLF. Understanding balled device printing When using Component Stenciling Templates to print on balled devices, the volume of solder paste has been tested to be the same quality as a generic solder print done by an in line printer. For example, a PBGA has a 30 mil ball and the solder paste printed on the pad, on the PCB, is generally 26 mils by 6 mil thick. Metcals printing process method has been evaluated to duplicate this requirement for printing on all PBGAs with this size solder ball. For this reason, we will not change print ratios to avoid a poor print release on the component, or solder defects such as bridging opens etc. Required Information to Order Custom Component Stenciling Templates A pattern that can be e-mailed or faxed. Include the table of contents in order to see the dimensions of the balls and pitch, and pattern required to manufacture the template. Pin no. 1 marked on the plate. This will help keep operators from attaching components in the wrong orientation. Carefully consider the orientation on plate before finalizing. Metcal now manufactures two BGA and Array Package Rework Systems in which the pick up of the component from the nest is different by 90? in relation of the pa