zt2传感器.pptVIP

Interaction between Laser and material Laser processing for material Cutting, Drilling, Microfabrication, Surface treatment, Study on the properties of plasmas produced by pulsed laser ablation of solid materials Pulsed Laser Deposition (PLD) Interaction of laser and atome, molecule and clusters. 1. Laser processing for material Cutting Welding Drilling Surface treatment Rapid prototyping Microfabrication Why use lasers for processing? High energy density Can be moved very quickly and accurately Low power reflected refracted scattered diffracted minimal energy absorption - non-contacting!’ High power - energy sufficient to heat melt evaporate burn Laser power for processing Continuous (CW) Important parameter is the power in Watts Between 100W and 20kW for materials processing Pulsed Important parameters are Joules per pulse、 duration ?p and repeat rate (Hz) Energy per pulse: 1mJ - 1kJ Pulse length - 1ms to 1ns Pulse repetition rate 0.1/s to 1000/s Energy (or power) density of a laser beam Defined as the energy (power)incident on unit area (per unit time) Laser power density=energy/(spot area? duration) Determined by laser power and beam size Can increase by focusing laser beam Limited by diffraction Diffraction limited spot size of a laser beam Assume that the laser has a diameter of D. It is focused by a lens of focal length f Give a spot size of dspot For example A laser beam of wavelength 10.6?m and diameter 5mm and power 1kW is focused by a lens of focal length 20mm. The laser power density is 1.2 x 107 W/mm2 Lasers used in materials processing CO2 CW or pulsed 10.6mm Nd-YAG CW or pulsed 1.06mm Excimer pulsed 0.1-0.2mm Semiconductor CW or pulsed Range Moving and directing the laser beam The size and shape of the beam can be controlled with lenses and other sorts of optical elements The path or location of the beam can be changed by moving mirrors or optical fibres Parameters which determine nature of interaction Power density