微纳电子技术2015年第6期摘要.PDFVIP

可延展柔性无机电子互连结构及其力学特性 林骅，潘开林，陈仁章，韦娜 （桂林电子科技大学机电工程学院，广西 桂林541004 ） 摘要：首先简要介绍了目前实现可延展柔性无机电子延展性的主要原理及方式，分析了目前 存在的问题；其次，总结了目前提高可延展柔性无机电子延展性能的主要设计，并对可延展 柔性无机电子互连结构的力学特性发展现状进行了分析。其中重点探讨了目前存在的互连导 线失效、异质界面的力学及其可靠性问题的研究现状；最后，针对目前可延展柔性无机互连 结构存在的界面可靠性问题，介绍了本课题组在该方面的数值仿真工作。主要分析了可延展 电子典型互连结构单元——马蹄形、Z 字形结构基底应力集中问题，并进行了上述结构界面 剥离的仿真分析。 关键词：可延展电子互连；结构设计；力学特性；界面可靠性；有限元分析 中图分类号：TN405.97 文献标识码：A 文章编号：1671-4776(2015)06-0341-07 Inorganic Stretchable, Flexible Electronic Interconnect Structure and Its Mechanical Properties Lin Hua, Pan Kailin, Chen Renzhang, Wei Na (Electromechanical Engineering College, Guilin University of Electronic Technology, Guilin 541004, China) Abstract:Firstly, the main mechanism and way of inorganic stretchable and flexible electronics to realize elasticity are brief introduced. The existing problems are analyzed. Then, the designs for increasing elasticity of inorganic stretchable and flexible electronics are summarized, and the recent advances of its mechanical property are analyzed. The research statuses of the interconnect failure, heterogeneous interface mechanics and reliability are mainly discussed. Finally, for the interfacial reliability of inorganic stretchable and flexible interconnects, the numerical simulation on the issue of the research group is introduced. The substrate stress concentration phenomena of the typical stretchable interconnect units, such as the horseshoe shape structure and the zigzag shape structure are mainly analyzed, and the simulation analyses of the interfacial delamination of above structures are presented. Key words:stretchable interconnect; structural design; mechanical property; interfacial reliability ； finite element analysis DOI:10.13250/ki.wndz.2015.06.001EEACC:2550F CdxZn1-xSeyS1-y 量子点量子阱 及有机-无机LED 李彦沛，刘孔，卢树弟，寇艳蕾，岳世忠 (中国科学院 半导体研究所 半导体材料科学重点实验室，北京100083) 摘要：为了提高无机纳米发光材料的发光效率和有机-无机杂化电致发光器件的性能，使用 有机金属前驱体法，制备了具