CuCrZr合金动态再结晶行为的研究.doc

CuCrZr合金动态再结晶行为的研究 摘 要 IC向短、小、轻、薄的方向发展，电子封装也随着向高密度封装发展，引线间距减小，厚度减薄，功率增加要求引线框架材料具有更高的强度、导电性和导热性。Cu-Cr-Zr合金具有高的强度和良好的导电、导热性能及抗氧化性，可作为电阻焊电极和结晶器等材料在电工、电力及航空等行业得到广泛的应用。 本文对Cu-Cr-Zr合金的再结晶行为进行了研究。利用Gleeble-1500热模拟实验机对Cu-Cr-Zr合金进行高温热压缩变形，研究在变形温度为50~750℃、应变速率为0.01~s-1工作条件下该合金的流变应力行为热变形流变应力本构方程Cu-Cr-Zr合金kJ/mol，并构建本构方程；通过显微组织分析，进而研究合金动态再结晶行为。 关键词： Cu-Cr-Zr合金，， on Dynamic Recrystallization Behavior of Cu-Cr-Zr Alloy ABSTRACT With the high integration of IC chip,IC turn to be shorter,smaller,lighter, thinner and the density of electronic packaging gets higher,While the strength, electrical conductivity and thermal conductivity of lead frame material increase with the decreasing of lead spacing and thickness.Cu-Cr-Zr alloy has been widely used as a resistance welding electrode and the mold material in the electrical,electricity and aviation industries because of high strength,good electrical conductivity,thermal conductivity and oxidation resistance. Dynamic recrystallization behavior of Cu-Cr-Zr alloy was studied. The flow stress behavior of Cu-Cr-Zr alloy was studied by thermal simulation test at the deformation temperature of 550~750℃ and the strain rate of 0.01~5s-1 on the Gleeble-1500 thermal mechanical simulator. The relationship among deformation temperature,strain rate and flow stress was investigated,While The constitutive equation was established and the activation energy was calculated.The results showed that the flow stress decreased with the increasing of deformation temperature and increase with the growth of strain rate. The constitutive equation was established with the activation energy 845.18kJ/mol. Dynamic recrystallization behavior was studied by the analysis of microstructure. KER WORDS: Cu-Cr-Zr alloys, hot deformation,deformation temperature, flow stress, constitutive equation, dynamic recrystallization 目 录 第一章 绪论 1 §1.1 铜合金开发必要性 1 §1.2引线框架用铜合金的发展 2 §1.2.1国外引线框架的发展现状 2 §1.2.2国内引线框架的发展现状 3 §1.3 本文的研究内容与意义 3 §1.3.1设计的依据与意义 3 §1.3.2 本文的研究内容和研究目的 4 第二章 试验材料和试验方