查询2980-0000-62供应商.PDFVIP

查询2980-0000-62供应商 ID 1020 V3.00 OSMP Microminiature Push-On Coaxial Connectors • Intermateable with Gilbert GPO™ Series • DESC approved • Enhanced performance features • Simplified Assembly M/A-COM’s OSMP microminiature push-on coaxial connectors provide solutions for today’s modular designs with denser pack- aging requirements. The extremely small size of the OSMP offers a versatile solution for high density packaging allowing connector center-to-center spacing of 0.170. The push-on interface facilitates easier assembly and test with a positive snap-in feature to indicate a fully mated connection. The rugged OSMP interface can withstand harsh environments of mechani- cal shock and vibration, typically found in military or aerospace related applications. M/A-COM’s OSMP connector interface is OSMP Shroud and Jack to Jack Adapter Assembly the standard used by Defense Electronics Supply Center (DESC) to generate the SMP push-on connector series. OSMP connectors can be your design solution for mechanical packaging and frequency response. The OSMP interface pro- vides 0.020 of radial misalignment for critical blindmate applica- tions. Mating forces are strictly controlled to ensure reliable connections per mated pair or when simultaneously mating mul- tiple connectors. Cable jacks include an anti-rocking ring to ensure reliable mechanical performance regardless of the oper- ating environment. OSMP connectors offer enhanced broadband VSWR performance of 1.15:1 max thru 26GHz and 1.40:1 max thru 40GHz. Standard design OSMP configurations include cable connectors, straight and right