SM生产流程与制程介绍.pptVIP

SMT Process Introduce Machine Type SMT Equipment Introduction SMT Equipment Introduction SMT Equipment Introduction SMT Equipment Introduction SMT Equipment Introduction SMT Equipment Introduction SMT Equipment Introduction SMT Equipment Introduction 表面粘著技術是什麼? 輕薄短小的實現 快穩準自動化的實現 標準化大量生產的實現 零件、材料、設備、製程的整合 高可靠度與高品質的表現 The component Comparison The SMD Technology Comparison 零件置放實景 * 課程的目的與目標 期望能對SMT製程有初步了解與認識 SMT(Surface Mount Technology)的英文縮寫,中文意思就是 表面貼裝技術 。是新一代的組裝技術,他將傳統電子元件 體積壓縮為大約十分之一,大大減少設計面積. 　 Process Flow Chart SMT 印刷機 SPI 高速機 泛用機 ICT 入庫 AOI QC Chart x-ray 迴焊爐 Visual 收板機 AOI 迴焊爐 泛用機 高速機 SPI 印刷機 送板機 收板機 AOI 迴焊爐 泛用機 高速機 SPI 印刷機 送板機 Solder Printing Pick place Reflow Turn Over Bare Board SMT Process Flow Diagram 2nd Side SMT SMT Layout Setup 印刷機 錫膏檢測機 高速機 泛用機 Screen Print Solder Paste Maximum Size 510 x 508 mm /(610 x 508mm*) Minimum Size 40 x 50 mm Thickness range 0.2 – 6 mm Underside component clearance 3- 42 mm Alignment: Stencil to Board Repeatability 1.6 Cpk @+/- 25μm Product Changeover: 2 minutes New Product Setup: 10 minutes Support 2D(Coverage) Inspection DEK Infinity API Solder Printing Pick Place Reflow Soldering AOI Inspection ICT Test X-Ray Inspection Solder Paste Inspection DEK(Screen Print Solder Paste) 鋼板 刮刀 錫膏 錫膏 刮刀 鋼板 PCB 作業內容：將錫膏印刷於PCB上 工作原理：PCB經過設備定位後,與鋼板接觸,透過鋼板開孔藉由刮刀將錫膏給擠壓自PCB的正確位置 TRI 7006 Solder Printing Pick Place Reflow Soldering AOI Inspection ICT Test X-Ray Inspection Solder Paste Inspection Solder Paste Inspection 12.345600 M Points/sec (9,645 fps x 1280 pixel) In-Line 100% Screening Scan Speed 160 mm/sec (193 mm/sec max) Gage Repeatability and Reproducibility Resolution 20 um Optical Resolution, 10 ~ 100 um Scanning Pitch Warp Coverage Scan Height Range 1.28 mm 32 pixel (16 ~ 64 suggested) SPI(Solder Paste Inspection) 錫膏膜厚測量儀 工作內容：透過光學檢測判定印刷製程穩定度，預防不良發生 工作原理：利用三角量測原理檢查錫膏厚度，藉由錫膏厚度的量測可算出錫點的體積，面積，同時藉由量測出之高度分布情形的加以分析後，