Principles of Plasma Discharges and Materials Processing第12章.pdfVIP

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Principles of Plasma Discharges and Materials Processing第12章.pdf

Principles of Plasma Discharges and Materials Processing第12章

CHAPTER 12 INDUCTIVE DISCHARGES The limitations of capacitive rf discharges and their magnetically enhanced variants have led to the development of various low-pressure, high-density plasma discharges. The distinction between low- and high-density discharges is described in Sections 10.1 and 10.2. A few examples are shown schematically in Figure 1.14, and typical parameters are given in Table 1.1. In addition to high density and low pressure, a common feature is that the rf or microwave power is coupled to the plasma across a dielectric window or wall, rather

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