切片缺点模式说明汇.ppt

切片缺點模式說明Cross-section Defect Mode 內容介紹 (CONTENT) 1. 通孔(Through via) 1.1. 熱應力前(Before thermal stress test) 1.1.1. 孔銅厚度/穿孔力(Copper thickness / Throwing power ) 1.1.2. 鍍銅斷裂(Plating crack) 1.1.3. 孔破(Plating void) 1.1.4. 壓合空泡(Air bubble) 1.1.5. 燈蕊效應(Wicking) 1.1.6. 回蝕(Etch back) 1.1.7. 反回蝕(Negative etch back) 1.1.8. 釘頭(Nail Head) 1.1.9. ICD-膠渣(Smear) 1.1.10. ICD-內層銅分離(Inner layer connection separation) 1.1.11. 孔壁粗糙度(Hole wall roughness) 內容介紹 (CONTENT) 1.2. 熱應力後(After thermal stress test) 1.2.1. 孔壁浮離(Pull away) 1.2.2. 樹脂內縮(Resin recession) 1.2.3. 內層連接不良(Innerlayer Connection Defect) 1.2.4. 鍍銅斷裂(Crack) 2. 盲孔(Blind via) 2.1. 一般盲孔 2.1.1. 銅厚(Copper thickness) 2.1.2. 碗型孔(Barrel Shaped) 2.1.3. 蟹腳(Crab feet) 2.1.4. 雷射膠渣(Laser smear) 2.1.5. 跳鍍(Step plating) 2.1.6. 孔破(bubble void) 2.2. 電鍍填孔(Fill via by plating) 2.2.1. 填孔凹陷(Dimple) 2.2.2. 空泡(Air bubble) 內容介紹 (CONTENT) 1.1.1.a 孔銅銅厚：Hole copper thickness 1.1.1.b 面銅銅厚：Surface copper thickness 1.1.1.c 穿孔力：Throwing Power 1.1.1.c 穿孔力：Through Power Specification: P.P thickness45Mil T/P=90% (↑) 45Mil≦ P.P≦ 75Mil T/P=80% (↑) P.P thickness75Mil T/P=75% (↑) 1.1.2. 鍍銅斷裂：Plating crack 1.1.3. 孔破：Plating void 1.1.4. 壓合空泡：Air bubble 1.1.5. 燈蕊效應 (Wicking) 1.1.6. 回蝕 (Etch back) 1.1.7. 反回蝕 (Negative etch back) 1.1.8. 釘頭 (Nail Head) 1.1.9. ICD-膠渣 (Smear) 1.1.10. ICD-內層銅分離 (Inner plane separation) 1.1.11. 孔壁粗糙度 (Hole wall roughness) 1.2.1. 孔壁浮離 (Pull Away) 2.1.1. 銅厚(Copper thickness) 2.1.2. 碗型孔 (Barrel shaped) 2.1.3. 蟹腳 (Under cut) 2.1.4. 雷射膠渣 (Smear ) 2.1.5. 跳鍍(Step plating) 2.1.6. 盲孔孔破(Void) 2.2.1. 填孔：Dimple 2.2.1. 填孔：Dimple 量測數據(measuring): 1.Dimple 2.P.P厚度(P.P. thickness) 3.上開口(Top width) 4.下開口(Bottom width) 2.2.2. 盲孔空泡(Air bubble) 3.1. 背光(Back Light) 2 3. 4 World Class Quality CONFIDENTIAL Unimicron * 3.外觀檢查(Visual inspection): 3.1.背光(Back Light) 3.2.板面燒焦(Burning) 3.3.電鍍顆粒(Copper Nodule) 3.4.鍍銅均勻性(Uniformity) 3.5.凹陷(Pin Dent) 3.6.刮傷(Scrab) 3.7.板面粗糙(Panel roughness