机种3073200048 功能不良分析总结 PN 3073200048 function issue customers complaint analysis summary 15.12.14.pptVIP

* * * * * * * * (#) 不想≠不能 不想≠不能 不想≠不能 不想≠不能 不想≠不能 不想≠不能 不想≠不能 不想≠不能 不想≠不能 不想≠不能 不想≠不能 不想≠不能 机种3073200048 功能不良分析总结 PN 3073200048 function issue customers complaint analysis summary Lewiss Lee 2015.12.14 Contents 问题描述 Describe the issue 原因分析 Root cause analysis 短期对策 Temporary countermeasure 长期对策 Permanent countermeasure 效果验证 Effect verification 2015年12月14日收到客户反馈3073200048功能不良2pcs, 不良品已经被拆解，实物图片如下， Dec 14th 2015, customer complaint function issue with 2pc of Media hub style, and defective samples as following images, and we have decapped the issue samples, 一、问题描述 Describe the issue 实物5 sample 5# 实物3 sample 3# 不良现象 D1锡裂 发生原因( Root cause) 从D1外观上，可以明显看到受到外力压迫导致的锡裂； We could find obvious pressure with force from D1 appearance; 二、原因分析 Root cause analysis 外观可见靠近D1位置的线束都有不同程度的损伤，可以确定线束之前挤压过D1元件,这是造成D1锡裂的原因,检查不良品PCB DC为1502, 所以他们应该是改善前生产的板子； We could find obvious different level of damage with wiring harness, and we confirm D1 was pressured by wiring harness，that is root cause for D1 split, and PCB DC for issue samples 1502, so they should be produced before improvement; 二、原因分析 Root cause analysis 实物5 sample 5# 实物3 sample 3# 二、原因分析 Root cause analysis 流出原因（Flow out reason) 测试时没有发生锡裂，所以测试结果Pass,但是由于线束在后续测试和使用中不断压迫到元D1件，最终造成D1锡裂。 There is no crack with D1 when operator test the issue sample, so the result of test is PASS, but after the subsequent test and use the finished product, the wirings still are always pressed the component D1, which cause split solder with D1. 三、短期对策 Temporary countermeasure 1.针对库存成品3000pcs 100%重新确认焊接效果同时安排再次测试，未发现不良(12月14日）。 To the stock in our W/H(3000pcs), we reconfirm the soldering effect and retest all stock, there is no defective found（Dec 14th). 2.测试后的板子做好打点标识(从4月21日开始）；