晶片来料检验.pptVIP

PC issue inspection requisition Box Label Device type Lot no Customer name Quantity Visual Sample Packing condition Wafer Qty Any damage 400x – 100x Dimension Thickness Ink thickness Complete Inspection Reports Incoming Wafer Inspection – PQI004 * Chipouts on edge of die shall not penetrate into any active circuit area. Note: Active circuit area is defined as from outside edge of the bond pads inward, except where there is an active line in the design located beyond the outside edge of the bond pads Cracks 裂縫 碎片 邊緣 不可 穿透 線路 活性的 採納 報廢 * Cracks shall not be longer than 1.0 mil in