英文版芯片封装.pptVIP

IC PACKAGING IC PACKAGING SEMICONDUCTOR MFG(BACK-END/PACKAGING) SMT PLASTIC PACKAGE : WAFER SAW/DICING DIE ATTACH/MOUNT WIRE BONDING MOLDING/ENCAPSULATION CROPPING/TRIMFORM SOLDER DIPPING TESTING PACKING SHIPPING SEMICONDUCTOR MFG(BACK-END/PACKAGING) BGA : WAFER SAW/ DICING DIE ATTACH/ MOUNT WIRE BONDING MOLDING/ ENCAPSULATION SAWING SOLDER BALL ATTACH TESTING PACKING SHIPPING WAFER SAW/DICING WAFER SAW/DICING WAFER SAW/DICING Singulation of individual die : Mounting tape frame Saw blades Washing Tape Curing DIE ATTACH/MOUNT DIE ATTACH/MOUNT Attach die to leadframe/substrate : Epoxy glue