无铅回流焊接设备的考虑事项.docVIP

Lead-Free Reflow Soldering Equipment Considerations 无铅回流焊接设备的考虑事项 Marc C. Apell Director of Marketing - Thermal and Cleaning Systems 市场总监- 热源和清洗系统 It is clear that the electronics industry is on the move to lead-free assemblies. This trend is an effort to remove hazardous lead from electronic packages and reduce the dependency on lead materials that can leach into the environment during processing or eventual disposal. The effort to go lead-free is driven by environmental considerations, governmental legislation, and the marketing advantages of lead-free electronic packages. 显而易见，电子行业正在迈向无铅组装。现在的趋势是努力去除电子封装上有害的铅和减少对铅的依赖，因为铅在处理过程中或最终废弃后会影响环境。环境保护的需要,政府法规的出台和无铅电子封装的市场优势推动了向无铅的转移。 While there are many decisions to consider in the implementation of lead-free assemblies in the manufacture process, this article will discuss equipment considerations of reflow ovens and the ability to process quality lead-free products. 在制造工艺中实施无铅组装时，需要考虑很多因素。本文将会讨论关于回流焊接设备及生产高质量无铅产品的能力所要考虑事项。 Solder Pastes 焊膏 The first step in a company’s lead-free initiative is the selection of solder pastes. While many types are available today, the biggest hurdle is finding a drop－in replacement for current leaded materials used today. The most dramatic issue facing solder pastes and reflow ovens is higher melting points, which make drop-in replacements for leaded materials difficult to find. To date, the most popular lead-free paste formulations include tin, silver, bismuth, and zinc. 实施无铅的第一步是选择焊膏。如今市场上有很多选择，最大的障碍是为当前使用的有铅材料寻找到一个直接的替代品。焊膏和回流炉面临最大的问题是更高的熔点，这使得找到直接的代替品非常困难。至今，最普遍的无铅焊膏合金包括锡，银，铋和锌。 The selection of lead-free solder pastes has also been a subject of many technical papers and extensive research. This research suggests that the most effective solder pastes have a melting point of from 217( C to 221( C. This represents a large increase from the traditional eutectic lead pastes with melting points of 183( C. Due to component temperature issues, maximum peak temperature and maximum