快速凝固对sn 3.0ag 0.5cu无铅钎料组织与性能的影响-effect of rapid solidification on microstructure and properties of sn 3.0 ag 0.5 cu lead-free solder.docxVIP

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快速凝固对sn 3.0ag 0.5cu无铅钎料组织与性能的影响-effect of rapid solidification on microstructure and properties of sn 3.0 ag 0.5 cu lead-free solder.docx

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快速凝固对sn 3.0ag 0.5cu无铅钎料组织与性能的影响-effect of rapid solidification on microstructure and properties of sn 3.0 ag 0.5 cu lead-free solder

摘摘要 A Abstract PAGE PAGE VI III III 的钎料焊点成形性更好；随着凝固速率的增加，，凝固速率越快的钎料，其熔程越窄，润湿力越大，钎焊过程中，钎料对母材的铺展润湿性越好，钎料与母材的相互作用更好充分，剪切强度更高。关键词：Sn-Ag-Cu 无铅钎料；快速凝固；显微组织；熔点；润湿性；剪切强度； Abstract As the era of electronic information technology coming, the electronic packaging technology plays a decisive role. The lead-free solder has been the hot topic long, however, there is still short-coming in the development and application. The main material of this research was the Sn-3.0Ag-5.0Cu lead-free solder. In this paper, the samples were prepared through the method of suction casting and melt-spinning. With the aid of SEM, XRD, EDS, DTA, solderability tester, solder joint strength tester and some other instruments, this paper studied the effects of the rapid solidification rate on the microstructure, melting characteristics, weldability, microhardness and solder shear strength. The result of microstructure analysis shows that the solidification rate obviously changes the microstructure of the solder alloy. From the edge to interside, the microstructure of suction casting samples changes significantly. The edge regional organization is the slim branch pointing to the center which is first precipitates phase β-Sn. The crystal particles between the branches are tiny. The central part of internal organization is the bulky grid shape organization with the existence of Ag3Sn and Cu6Sn5. On the condition of rapid solidification, the microstructure of melt-spinning sample is more even and tiny. The high melting phrase Ag3Sn and Cu6Sn5 and Sn form pseudo eutectic organization with the shape of small round state or small stick grain. The boundary between primary phase β-Sn and crystal organization is becoming blur. Sole β-Sn can not be found in the microstructure pictures. With the rising speed of cooling and solidificating, the organization grain constantly decrease. The result of the study on characteristics and thermal stability of the solder indicates that with the increasing cooling sol