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乐金(WIRETECH) - Your Bonded Wire Provider
WIRETECH
WIRETECH
樂金股份有限公司
Bonded Wire Provider
1
Outlook of Company
Wiretech Profile
Established in Nov. 2008 with dedicated mission
of offering competitive solution for bonding wire.
WT believe in fulfilling customer’s demand
satisfaction to drive us forward. We commit in
continuous cost-down efforts.
WT has developed for a variety of fine metal wire
like Au, Ag, Cu, Al, Ni, alloy, and coating with
micro metal material on fine wire surface.
History of Wiretech
Apr. 2000 Established a research team
Dec. 2005 RD department was founded in
Sureway Technology Co.,Ltd.
Nov. 2008 Spin-off from Sureway Technology Co., Ltd. to
Wire Technology Co., Ltd (樂金股份有限公司 )
Nov. 2008 Start Production.
Dec. 2008 Developed KH and K1H- type alloy wire.
May. 2009 Certificated by ISO 9001.
JUN. 2009 K1H Type alloy wire was qualified by customers.
Sep. 2009 K1H Type alloy wire was shipped by customers.
Jan. 2010 KH Type alloy wire was qualified by customers.
Apr. 2010 KH Type alloy wire was shipped by customers.
Oct. 2010 Taichung New Plant was built and ready.
Nov. 2010 Certificated by ISO 14001.
Research Development
2005 2008 2010 2012
Drawing
Machine
Model 2 Model 3
Fine Wire
Diameter
0.06~0.025 mm 0.025~0.015 mm 0.0175 mm 0.0150 mm
Fine Wire
Type
Au plated Cu Wire Alloy Metal wire Alloy Metal wire
Ag plated Cu Wire K1H, KH KM
Sn plated Cu Wire
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