Finite Element Analysis of Multilayer Transmission Lines for High-Speed Digital Interconnects多层传输分析.pdfVIP

Excerpt from the Proceedings of the COMSOL Conference 2010 Boston Finite Element Analysis of Multilayer Transmission Lines for High-Speed Digital Interconnects S. M. Musa and M. N. O. Sadiku Corresponding author: Roy G. Perry College of Engineering, Prairie View AM University Prairie View, TX 77446, smmusa, mnsadiku @pvamu.edu Abstract: In this paper, we consider the finite Previous attempts at the problem include using element modeling of multilayer transmission the method of moments [1, 2], the spectral lines for high-speed digital interconnects. We domain approach [3, 4], the Green’s function mainly focused on the modeling of the approach [3, 5], the method of lines [6, 7], the transmission structures with both cases of domain decomposition method and finite symmetric and asymmetric geometries. We difference methods [7], the integrated equation specifically designed asymmetric coupled method [8], and the complex image method [9]. microstrips and four-line symmetric coupled Also, the pulse distortion on symmetric, coupled, microstrips with a two-layer substrate. We lossy microstrips discussed in [10]. computed the capacitance matrix for asymmetric coupled microstrips and the capacitance, inductance, and impedance matrices for four-line In this work, we design asymmetric coupled symmetric coupled microstrips on a two-layer microstrips and four-line symmetric coupled substrate. We also provide the potential microstrips with a two-layer