Parametric Analysis of TEBGA Reliability Using a Finite-Volume 采用有限体积TEBGA可靠性参数分析.pptVIP

Parametric Analysis of TEBGA Reliability Using a Finite-Volume-Weighted Averaging Technique Hsien-Chie Cheng Computational Solid Mechanics Laboratory National Center for High-Performance Computing Kuo-Ning Chiang Power Mechanical Engineering National Tsing Hua University Chao-Kuang Chen Computational Solid Mechanics Laboratory National Center for High-Performance Computing Outline Introduction Modeling The Finite-Volume-Weighted Averaging Technique Parametric Design of The TEBGA Reliability Conclusions Introduction BGA: PBGA, CBGA, TBGA, CCGA PBGA over CBGA: Lower cost of substrate Smaller global CTE mismatch from PCB Lower profile Conventional Over Molded PBGA Packages Experience: Excessive moisture sensitivity of substrate Poor thermal performance of over molded compound TEBGA Provides: The enhanced thermal performance over PBGA Relatively cost-effective over CBGA With Solder Joint Reliability(SJR) in Concern: Similar to PBGA, potential SJR problems still occur in TEBGA. Introduction (Cont.) Many Studies on C-up PBGA Reliability: Paydar et. al., 1994; Pan, 1994; Hong, 1997; Jung et. al,1997; Winter and Wallach, 1997; Lau and Pao, 1997, etc. Few Investigations on C-down TEBGA: Pao et. al, 1998; Lee and Lau, 1998, etc. Most focus on the prediction of SJR. SJR is function of many parameters. Appropriate combinations of these parameters can signigicantly enhance SJR. Two Techniques for this Purpose: Design of Optimization (DO) or Design of Experiment (Box, 1978) Require tremendous, time-comsuming trials Parametric FEA (Yeh et. al, 1996) More cost-effective Reflect the effect of each parameter on the problem in concern Introduction (Cont.) Characterization of Strain/Stress Concentration Field is Critical. Fatigue life Stress/Strain Information Stress/Strain Information Mesh Desnsity (Due to material and geometry singuarities) Techniques: Explicit geometry representation (Fillet) High mesh density Material-nonlinear modeling