COG 制程介绍.pptVIP

James/ADT * AU Optronics Corp. * COG 製程介紹 一、課程目標: 1-1:使學員瞭解COG製程原理 1-2:使學員瞭解COG製程動作流程 1-3:使學員瞭解COG製程之檢驗規範 1-4:使學員瞭解COG製程之Defect Mode 二、課程對象: 2-1:LCM廠製程與設備工程師 2-2:對COG製程有興趣的同仁 三、授課時數: 3-1:COG製程原理及動作流程15 min 3-2:COG製程檢驗規範 10 min 3-3:COG製程之Defect Mode 5 min 課程導覽 TFT LCD Process Cell Module Array S/G FPC Cell Kitting Laser Cut COG S/G FPC COG PCB PCB Test SLC JBO MA Assemble Test JI Module JI COG Process COG: Chip On Glass Purpose: Combine Driver-IC with Cell Key Components: Cell ACF Driver IC (LSI) Cell Pad Cell Bonding area Driver IC IC on Tray Gold Bump Output side (Cell) Input side (FPC/PCB) MEC IC Driver IC Al Au Passivation Ti / W Gold bump profile ACF Introduction ACF: Anisotropic Conductive Film (異方向性導電膜) 目的: 垂直方向?電氣導通 水平方向?電氣絕緣 主要組成: 黏著劑 導電粒子 ACF Introduction ACF Cell IC ACF Cell IC Step 2 Step 1 Force Each channel Conductive independently ACF Introduction Hitachi ACF Adhesive Conductive Separator 4.5 month / 10 days 7 month / 30 days Expiration time(5 ℃/RT) 50 um 50 um Separator thickness 8 ± 1 um 8 ± 1 um Conductive thickness 15 ± 2 um 15 ± 2 um Adhesive thickness 3 ± 1 um 3 ± 1 um Particle size 150℃/ 100MPa / 10s 190℃/ 100MPa / 10s Mainbond parameter 80℃/ 1MPa / 3s 80℃/ 1MPa / 3s Attach parameter 10E9 Ω or more 10E8 Ω or more Insulation resistance 5.0 Ω or less 5.0 Ω or less Connection resistance 44,000 ± 12,500 pcs/mm2 44,000 ± 12,500 pcs/mm2 Conductive Particles 50 m 100 m Length 1.5 ± 0.1 mm 1.5 ± 0.1 mm Width 23 ± 3 um 23 ± 3 um Thickness AC-8623 AC-8601 Type ACF Introduction Bump (before bonding) Bump (ACF cleaned) Conductive Particle Bump (after bonding) ACF Introduction COG Process ACF 反應率需達 80 % 以上 ACF Introduction 為何使用 AC-8623 (低溫) 解決 Tool Mura 問題 COG Process Flowchart Wet C