十二烷基胺桥联poss材料的制备及其疏水性能分析-preparation and hydrophobic property analysis of dodecyl amine bridged poss materials.docxVIP

目录摘要...............................................................................................................................IAbstract...........................................................................................................................II第1章绪论................................................................................................................11.1课题背景和研究的意义.......................................................................................11.2桥联聚倍半硅氧烷类杂化材料...........................................................................21.2.1桥联单体的制备............................................................................................21.2.2桥联聚倍半硅氧烷类杂化材料的研究进展................................................51.3疏水材料研究进展...............................................................................................71.3.1疏水理论........................................................................................................71.3.2疏水材料表面构造方法..............................................................................101.3.3聚倍半硅氧烷类疏水杂化材料研究进展...................................................111.4课题的研究内容.................................................................................................13第2章实验材料和实验方法......................................................................................152.1实验仪器及药品.................................................................................................152.2桥联单体的制备.................................................................................................162.2.1单体制备条件的初步探索..........................................................................162.2.2单体制备工艺优化......................................................................................172.3酸催化一步法制备桥联聚倍半硅氧烷材料.....................................................202.3.1桥联POSS材料合成中工艺参数的选择202.3.2材料合成中原料配比的选择优化..............................................................212.3.3不同后处理条件的探索.....................................