Sn-ZnCu焊点时效后剪切强度与界面显微组织分析 (毕业论文).docVIP

哈尔滨工业大学工学硕士学位论文 - PAGE II - - PAGE I - Sn-Zn/Cu焊点时效后剪切强度与界面显微组织分析 摘要 由于环境保护法规和微电子高集成化发展的要求，新型无铅电子焊料的研究和开发成为电子和材料界近年的热点之一。目前应用最为广泛的是Sn-Ag-Cu系合金无铅焊料，但其价格较高。因此成本低廉、熔点较低、力学性能良好的共晶Sn-Zn系合金Sn-9Zn受到许多研究者的关注。近年来，已有部分有关Sn-Zn无铅钎料剪切强度及界面显微组织的研究，但这些研究主要集中在Sn-Zn合金用于两Cu片搭接形式，对于其在PCB板焊点的的研究甚少。 本文以Sn-9Zn无铅钎料为研究对象，采用OM， SEM，及EDS等分析手段，主要研究了Sn-Zn/Cu焊点在150℃，时效160小时后的剪切强度及其界面显微组织。结果表明，随BGA球直径增大，时效后界面处(Cu、Zn)6Sn5金属间化合物（IMC）增多，界面化合物层厚度增加，其剪切强度先降低然后增大。焊点直径为750μm时，在界面处Cu原子与Sn、Zn形成Sn-Zn-Cu化合物；焊点直径为1000μm时，Cu原子穿过界面，进入钎料内部，在钎料内与富Zn相形成Cu5Zn8化合物，与Sn相形成(Cu、Zn)6Sn5，并且这两种化合物呈层片状交叉分布；焊点直径为1300μm时，Cu原子并未扩散出界面，在界面内与Zn、Sn形成(Cu、Zn)6Sn5和Cu5Zn 关键词 Sn-9Zn；时效处理；剪切强度；IMC；显微组织 Analysis of Aging Treatment on Microstructure and Shear Strength of Sn-Zn/Cu solder joint Abstract Development of lead-free solders has been an urgent task in electronics end materials industry because of the prohibition of lead-containing solders by legislations of environment concern and the requirement of high-density integration development of microelectronics. At present , the most widely used lead-free solders are Sn-Ag-Cu, but their price is higher. So, eutectic Sn-9Zn has gained much attention because of its low cost, favorable melting point and good mechanical properties.In recent years, there have been some researches on shear strength and microstructure interface of Sn-Zn lead-free solders, but these researches mainly focus on the Sn-Zn alloy ,which is used for lap welding of copper sheet, while its PCB welding is scarce. In this paper, the effect of aging treatment under 160h,150℃on microstructure and shear property of Sn-Zn/Cu solder joint are studied by optical microscope(OM)，scanning electron microscope(SEM)，energy dispersive spectrdmeter(EDS).The result showed that the effective contact area of Sn-Zn/Cu solder joints increased with the diameter of BGA increases. After aging treatment, (Cu、Zn)6Sn5 intermetallic compound (IMC) increased, while the shear strength reduced.And after aging treatment, Cu atoms in Sn-Z